The upcoming US ban targets the Chinese semiconductor industry in what is expected to be the third significant crackdown in three years. However, the number of companies affected has been reduced from an earlier estimate of 200 to 140, with HBM memory designated as a primary target of these measures
Samsung Electronics and SK Hynix, while competing in memory development for artificial intelligence (AI), have agreed to collaborate on accelerating technology standardization
Japanese IC substrate maker Ibiden is ramping up production capacity in response to rising demand linked to generative AI, with plans centered on renovating its current facilities to increase output
Luxshare Precision, a key Chinese partner of Apple, is expanding its production capacity in Vietnam through a significant enlargement of its Nghe An facility. The workforce is expected to grow from 12,000 to 60,000–80,000, reinforcing its position in Apple's global supply chain
The US Department of Commerce's Bureau of Industry and Security (BIS) released a new regulation on December 2, adding 140 Chinese companies to the Entity List. This regulation targets 24 types of semiconductor manufacturing equipment, three categories of electronic design automation (EDA) tools, and high bandwidth memory (HBM)
Chinese outsourced semiconductor assembly and test (OSAT) providers have intensified their capacity expansion for advanced packaging to support the country's semiconductor self-sufficiency amid growing artificial intelligence (AI) application demands
The US Department of Commerce announced on November 29, 2024, its preliminary findings in antidumping duty investigations targeting crystalline photovoltaic cells and modules from Cambodia, Malaysia, Thailand, and Vietnam
The US government is preparing to expand restrictions on semiconductor equipment and related chip sales to China, particularly targeting AI and High Bandwidth Memory (HBM) products. This move will have minimal impact on TSMC but could create new opportunities for United Microelectronics (UMC) and Vanguard International Semiconductor (VIS), according to industry sources
The European automotive supply chain faces deepening turmoil, with industry giants like Bosch, Valeo, and Ford announcing extensive layoffs. These developments underscore the ongoing slump in market conditions and the mounting pressure on supply chain sustainability across the region
China's satellite navigation ambitions are accelerating, with plans for a next-generation BeiDou system taking shape amid growing commercial adoption of the technology. The expansion comes as Chinese tech giants leverage satellite capabilities in their latest devices, exemplified by Huawei's satellite-enabled Mate 60 smartphone and its new Mate X6 foldable flagship, which features innovative three-network satellite connectivity
Japan's Ministry of Economy, Trade, and Industry (METI) has announced a subsidy program totaling up to JPY70.5 billion (US$470.34 million) for the SiC power semiconductor production collaboration between Denso and Fuji Electric. The joint project, valued at JPY211.6 billion, will receive one-third of the total investment in government funding
Global supply chains have gradually diversified in recent years, with India emerging as a potential replacement for China in the electronics manufacturing sector. As geopolitical dynamics shift, particularly influenced by the recent US presidential election, interest from European and American clients in Indian manufacturing is on the rise
Mitsubishi Electric President and CEO, Kei Uruma, revealed in a Tokyo interview that the company is pursuing a restructuring initiative within Japan's power semiconductor sector, including with former competitors. The goal is to strengthen its position in this critical market segment
Murata Manufacturing Co. has unveiled a new mid-term business plan focused on boosting market share for its flagship product, Multi-layer Ceramic Capacitors (MLCCs), in response to price competition from other Asian manufacturers. The plan also targets the increasing demand for AI servers
Recently, Huawei's executive director and chairman of the board of directors of the consumer business group (BG), Richard Yu, announced that the new foldable flagship smartphone, Mate X6, will feature a triple-network satellite version. In addition to supporting two-way satellite messaging and two-way calling, the device will now also incorporate low Earth orbit (LEO) satellite internet
