The upcoming US ban targets the Chinese semiconductor industry in what is expected to be the third significant crackdown in three years. However, the number of companies affected has been reduced from an earlier estimate of 200 to 140, with HBM memory designated as a primary target of these measures
Samsung Electronics and SK Hynix, while competing in memory development for artificial intelligence (AI), have agreed to collaborate on accelerating technology standardization
Japanese IC substrate maker Ibiden is ramping up production capacity in response to rising demand linked to generative AI, with plans centered on renovating its current facilities to increase output
The US Department of Commerce's Bureau of Industry and Security (BIS) released a new regulation on December 2, adding 140 Chinese companies to the Entity List. This regulation targets 24 types of semiconductor manufacturing equipment, three categories of electronic design automation (EDA) tools, and high bandwidth memory (HBM)
Almost a year after the initial announcement, JCET has completed its stock-holding transfer and appointed a new chairman, solidifying control under a Chinese state-owned conglomerate. This move positions the conglomerate as the dominant force behind China's largest OSAT OSAT provider
The US government is preparing to expand restrictions on semiconductor equipment and related chip sales to China, particularly targeting AI and High Bandwidth Memory (HBM) products. This move will have minimal impact on TSMC but could create new opportunities for United Microelectronics (UMC) and Vanguard International Semiconductor (VIS), according to industry sources
The European automotive supply chain faces deepening turmoil, with industry giants like Bosch, Valeo, and Ford announcing extensive layoffs. These developments underscore the ongoing slump in market conditions and the mounting pressure on supply chain sustainability across the region
China's satellite navigation ambitions are accelerating, with plans for a next-generation BeiDou system taking shape amid growing commercial adoption of the technology. The expansion comes as Chinese tech giants leverage satellite capabilities in their latest devices, exemplified by Huawei's satellite-enabled Mate 60 smartphone and its new Mate X6 foldable flagship, which features innovative three-network satellite connectivity
Global supply chains have gradually diversified in recent years, with India emerging as a potential replacement for China in the electronics manufacturing sector. As geopolitical dynamics shift, particularly influenced by the recent US presidential election, interest from European and American clients in Indian manufacturing is on the rise
Mitsubishi Electric President and CEO, Kei Uruma, revealed in a Tokyo interview that the company is pursuing a restructuring initiative within Japan's power semiconductor sector, including with former competitors. The goal is to strengthen its position in this critical market segment
Murata Manufacturing Co. has unveiled a new mid-term business plan focused on boosting market share for its flagship product, Multi-layer Ceramic Capacitors (MLCCs), in response to price competition from other Asian manufacturers. The plan also targets the increasing demand for AI servers
Recently, Huawei's executive director and chairman of the board of directors of the consumer business group (BG), Richard Yu, announced that the new foldable flagship smartphone, Mate X6, will feature a triple-network satellite version. In addition to supporting two-way satellite messaging and two-way calling, the device will now also incorporate low Earth orbit (LEO) satellite internet
South Korean AI chip startup DeepX is in the final stages of preparation for its first mass-produced chips. Through Samsung Electronics' foundry division, the company has achieved an 88% yield rate using advanced 5nm process technology, with expectations to surpass 90% in mass production—a promising indicator for this cutting-edge AI hardware initiative
Samsung Electronics has reportedly reduced its use of thick photoresist (PR) in the photolithography process for its latest 3D NAND flash, achieving significant cost savings. This move, however, could impact its South Korean supplier, Dongjin Semichem
