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IN THE NEWS
Wednesday 4 December 2024
Samsung and SK Hynix collaborate to promote LPDDR6-PIM standardization
Samsung Electronics and SK Hynix, while competing in memory development for artificial intelligence (AI), have agreed to collaborate on accelerating technology standardization.
Wednesday 4 December 2024
Ibiden plans 40% output boost for AI server IC substrates in 2025
Japanese IC substrate maker Ibiden is ramping up production capacity in response to rising demand linked to generative AI, with plans centered on renovating its current facilities...
Tuesday 3 December 2024
Global industry leaders back Taiwan's emerging satellite sector amid key challenges
Recent advancements in communication technology have lowered barriers in the space industry, enabling commercialization and attracting a wave of innovative players. While Taiwan-based...
Tuesday 3 December 2024
TASTI Expo 2024: CubeSat, SAR, drone-satellite synergy
Nearly 60 space companies are showcasing their latest innovations at TASTI Expo 2024, demonstrating Taiwan's growing aerospace capabilities. The Taiwan Space Agency (TASA) leads the...
Tuesday 3 December 2024
Power semiconductor firms explore niche auto markets amid headwinds
Major integrated device manufacturers (IDM) are pessimistic about automotive chip prospects in 2025, with Taiwan-based power semiconductor firms taking cautious stances on the European...
Tuesday 3 December 2024
Ubiqconn showcases next-gen satellite solutions at TASTI 2024, deepening presence in global satcom networks
Ubiqconn Technology, a Taiwan-based satellite equipment manufacturer and systems integrator, demonstrated its expertise at the 2024 Taiwan International Assembly of Space Science,...
Tuesday 3 December 2024
Danish investors urge Taiwan to speed up renewable energy shift
Danish officials are pressing Taiwan to accelerate its green energy transition, warning that mounting global competition for renewable resources could threaten the island's ability...
Tuesday 3 December 2024
CIP secures Taiwan's first corporate wind power deal
Copenhagen Infrastructure Partners (CIP) has marked a watershed moment in Taiwan's renewable energy sector by securing the first corporate power purchase agreement for its Round 3...
Tuesday 3 December 2024
Shinkong diversifies amid European auto slump, eyes AI server opportunities
Shinkong Synthetic Fibers continues to navigate through Europe's prolonged automotive market downturn by implementing proactive diversification strategies and making a strategic entry...
Tuesday 3 December 2024
European auto layoffs ripple across supply chains as Chinese EV makers face setbacks
The European automotive supply chain faces deepening turmoil, with industry giants like Bosch, Valeo, and Ford announcing extensive layoffs. These developments underscore the ongoing...
Tuesday 3 December 2024
IPC makers demonstrate resilience, remain unfazed by tariff shifts
Taiwan's industrial computer (IPC) manufacturers are maintaining their composure despite the ripples sent through global supply chains by Donald Trump's recent announcement of tariff...
Tuesday 3 December 2024
Airoha secures R&D funding, challenges Qualcomm with Bluetooth audio chips
According to Taiwan's Ministry of Economic Affairs, MediaTek subsidiary Airoha has secured NT$140 million (US$4.3 million) in R&D subsidies through the ministry's A+ Industrial...
Tuesday 3 December 2024
Denso, Fuji Electric secure METI subsidy for SiC chip mass production
Japan's Ministry of Economy, Trade, and Industry (METI) has announced a subsidy program totaling up to JPY70.5 billion (US$470.34 million) for the SiC power semiconductor production...
Monday 2 December 2024
Notebook shipment update, October 2024
Notebook deployment at channels in Europe and North America for year-end holidays decelerates, leading to a 26% on-month shipment deceleration for top-5 notebook brands together in...
Monday 2 December 2024
TSMC evolves CoWoS technology, to challenge 9x reticle sizes in 2027
TSMC announced at the Open Innovation Platform (OIP) Ecosystem Forum in Europe that its CoWoS packaging technology will achieve certification by 2027, introducing a version with 9x...