Following Donald Trump's re-election as US President, concerns are mounting over potential new tariffs on the server supply chain. Mike Yang, EVP and GM of Cloud Computing at Quanta...
On November 11, 2024, TSMC reportedly suspended its sub-7nm process services to China's AI and GPU chipmakers following the Huawei "chip controversy," triggering widespread industry...
Adata reported October 2024 revenue of NT$34.1 billion (approx. US$1.06 billion), driven by increased DRAM shipments. The company is nearing its 2023 revenue performance and targets...
Wafer Works is building a 12-inch wafer fab in Erlin, Changhua County, with a monthly capacity of 200,000 units to meet global demand. The topping-out ceremony is scheduled for December...
Following the release of its third-quarter financial results, SMIC co-CEO Haijun Zhao expects price competition to persist and aims to capture one-ninth of global semiconductor ord...
SMIC, China's largest pure-play semiconductor foundry, recorded US$2 billion in revenue in a single quarter, with its utilization rate surpassing 90%. However, its relatively limited...
Taiwan-based CWTC's board has approved several key resolutions, including the third-quarter 2024 profit distribution plan and a US$20 million cash capital increase for its Malaysian...
SK Hynix has strengthened its collaboration with TSMC, designating the foundry to manufacture its next-generation HBM4 logic die. The company's development of high-capacity Compute...
SK Hynix plans to reduce its legacy DRAM production to 20% by the fourth quarter of 2024, responding to increased supply and pricing pressure from Chinese memory manufacturers. The...
Vanguard International Semiconductor (VIS) reports that while price competition has diminished, market competition pressure persists due to continued mature process fabrication capacity...
Display driver IC (DDI) specialist Ilitek is poised to re-enter the capital market in late November as ITH Corporation. Ahead of ITH's upcoming listing on the stock market, chairman...
SK Hynix plans to provide samples of its 48GB, 16-layer HBM product—the industry's largest capacity and highest layer count—in the first quarter of 2025. CEO Noh-Jung...
OSAT ASE Technology (ASEH) has stepped up its pace of capacity expansion for advanced packaging to meet demand for AI device applications, which it anticipates to be a continual growth...
Intel CEO Pat Gelsinger will visit TSMC in Taiwan in November, according to industry sources, who also believe that recent media claims about TSMC withdrawing the Intel discount are...
Micro LED technology is emerging as a promising solution for high-speed AI data transmission and SiPh-based optical communication. Dr. David Su, Chief Strategy Officer of Ennostar,...
