Advanced material provider Wah Hong is developing packaging and materials for Micro LED and Mini LED technologies with prices ranging from US$200 to US$300 per square meter. Company...
Fan-out panel level packaging (FOPLP) is a promising semiconductor technology that has been attracting investments from Taiwan's supply chains, including IC foundries, OSATs, panel...
Wah Lee Industrial Corporation has successfully integrated its CoWoS packaging materials into the supply chain of leading semiconductor manufacturers. Shipments are expected to increase...
AUO has said they are focusing on silicon photonics opportunities while holding onto its cautious approach panel-level fan-out packaging (FOPLP), a notable divergence from its rivals...
As AUO (AU Optronics) undergoes a strategic transformation, the company maintains a cautious stance on fan-out panel level packaging (FOPLP) but shows increased optimism about silicon...
Powertech Technology (PTI), a backend service provider, anticipates that orders for AI device applications will constitute a larger portion of the company's revenue. This is attributed...
Innolux has gained attention for entering fan-out panel-level packaging (FOPLP). The Ministry of Environment recently commended the company for its resource recycling efforts, highlighting...
Tongtai Machine & Tool is intensifying its expansion into the semiconductor sector, targeting automotive, aerospace, medical, and electronic semiconductors. The company forecasts...
Nano Electronics and Micro System Technologies (NEMStek), a developer of plasma technologies and surface treatment solutions, has entered the supply chains of Chinese and Taiwanese...
Following the sale of its Fab 4 to TSMC, rumors have emerged that Innolux may soon sell additional factories to TSMC, causing unease among employees and the supply chain. In response,...
Taiwan-based LCD panel maker AU Optronics (AUO) has dismissed speculation that it is planning to establish a foothold in semiconductor packaging by developing FOPLP.
Prominent OSATs have allocated a greater capital expenditure for 2024 compared to 2023, suggesting that their existing production capacity for advanced packaging is still limited,...
Innolux is expanding its fan-out panel level packaging (FOPLP) technology focus beyond automotive and power management ICs (PMIC) to include high-end applications.
Mirle has achieved significant progress in its semiconductor equipment systems operations recently. As the semiconductor sector has experienced a notable surge in growth momentum,...
