TSMC announced at the Open Innovation Platform (OIP) Ecosystem Forum in Europe that its CoWoS packaging technology will achieve certification by 2027, introducing a version with 9x...
TSMC's CoWoS technology continues to scale, driven by strong demand from major clients such as Nvidia. Production capacity is projected to reach 75,000 units by 2025, with the persistent...
On November 8, news broke that China's 7nm chip manufacturing supply was cut off, prompting major foundries like TSMC and Samsung Foundry to remain silent. However, recent reports...
TSMC plans to more than double its CoWoS packaging production capacity to meet the surging AI server demand in 2025. Industry sources indicate that Nvidia will consume up to 60% of...
TSMC is strategically developing a dedicated supply chain cluster on 30 hectares (300,000 square meters) of land in Southern Taiwan Science Park (STSP) to strengthen its advanced...
Taiwanese semiconductor equipment manufacturers working with TSMC are benefiting significantly from its orders, with eight of them reporting gross margins of 40-60% in the second...
Driven by rising demand for chip-on-wafer-on-substrate (CoWoS) and other advanced packaging equipment, Taiwan-based semiconductor automation and wet process equipment maker Grand...
Rising global uncertainties following Donald Trump's presidential victory have led TSMC to recalibrate its ambitious expansion plans for Chip-on-Wafer-on-Substrate (CoWoS) packaging...
Grand Process Technology Company (GPTC), a Taiwan-based semiconductor equipment company involved in the supply chain for TSMC's CoWoS packaging, aims to leverage the rising demand.
A recent annual forum for the chipmaking equipment and materials sectors was hosted in Tainan, southern Taiwan, bringing together executives from TSMC and its ecosystem partners including...
Wah Lee Industrial Corporation has successfully integrated its CoWoS packaging materials into the supply chain of leading semiconductor manufacturers. Shipments are expected to increase...
Egis Technology (EgisTec), recently transformed into the ASIC business, has signed a strategic cooperation agreement with South Korean chip design company Asicland. The two companies...
Intel CEO Pat Gelsinger was recently in Taiwan for a brief visit to meet with TSMC chairman C. C. Wei at the Hsinchu Science Park (HSP), according to sources familiar with the matt...
Global demand for Chip-on-Wafer-on-Substrate (CoWoS) and CoWoS-like packaging capacity will likely grow by 113% annually in 2025, driven by robust demand for cloud AI accelerators,...
Hon Precision, Inc. (HPI), based in Taiwan, will be listed on the Emerging Stock Board (ESB) on October 31. The company, which specializes in backend semiconductor test handlers and...
