Arm CEO Rene Haas has openly expressed his aspirations for AI, envisioning that all future AI applications will run on Arm technology in some form. This strategic shift suggests that...
South Korean AI chip startup DeepX is in the final stages of preparation for its first mass-produced chips. Through Samsung Electronics' foundry division, the company has achieved...
Market speculation suggests that the US may impose stricter restrictions on China. On November 28, it is anticipated that 200 Chinese semiconductor companies will be added to a trade...
Huawei is reportedly advancing its plans to mass-produce the Ascend 910C AI chip in the first quarter of 2025, even as the company grapples with extremely low wafer yields. Simultaneously,...
On November 8, news broke that China's 7nm chip manufacturing supply was cut off, prompting major foundries like TSMC and Samsung Foundry to remain silent. However, recent reports...
South Korea's struggle to obtain AI chips has stalled its national supercomputer project, raising concerns about its ability to stay competitive in global scientific and technological...
TSMC has reportedly notified Chinese customers that shipments of AI-related chips made with 7nm or below processes will be halted. Additionally, any AI chip projects initiated after...
On November 11, 2024, TSMC reportedly suspended its sub-7nm process services to China's AI and GPU chipmakers following the Huawei "chip controversy," triggering widespread industry...
Chinese media reports that TSMC has formally notified its Chinese AI chip customers via email that, starting November 11 — known as Singles' Day in China — it will cease...
Japan's Leading-edge Semiconductor Technology Center (LSTC) has forged a strategic partnership with Canadian chip designer Tenstorrent to train up to 200 Japanese engineers in the...
DIGITIMES Research observes that China is rapidly advancing in the field of LLMs. Major technology giants such as Baidu, Alibaba, and Tencent have launched their self-developed LLMs...
TSMC is strengthening its partnerships with OSAT providers, outsourcing key stages of its CoWoS packaging technology. ASE's subsidiary Siliconware Precision Industries (SPIL) has...
Thanks to the AI tsunami, demand for AI chips from all sectors is continuing to surge. The Chip-on-Wafer-on-Substrate (CoWoS) architecture that dominates existing 2.5D and 3D packaging...
Nvidia CEO Jensen Huang is set to visit India later this week, where the GPU and AI chip design company reportedly plans to co-develop a chip, capitalizing on the country's abundant...
